A PTFE substrate measuring 5 cm x 5 cm x 4.19 mm (165 mils) thick and containing drilled through holes having 457.2 mu m (18 mils) diameter or an aspect ratio of 9.16-to-1 is exposed to the reducing bath for 10 minutes with constant agitation of the substrate to promote solution flow through the vias.
5cm×5cm×165ミルの厚さの寸法で18ミルの直径または9.16〜1のアスペクト比を有する穴をあけたPTFE基体を一定速度で激しく揺り動かしながら還元浴へ10分間さらし、バイアを通る溶液の流れを促進させた。
Furthermore, these "dry processes" have the potential advantage of greater process control and higher aspect ratio images.
さらに、これらの「乾式法」は、工程管理を改善し、像のアスペクト比を高めるという利点を潜在的に有する。